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Modelling of high bit rate on-chip interconnections, aiming to push the silicon bipolar technology into the deep submicron range and to develop design expertise and CAD activities in the field of digital and mixed analogue-digital applications.
Modelling of high-bit rate multi-chip interconnection; the objective of this work is to derive through electrical modelling design tools for high-density off-chip interconnect technology compatible with high-speed ICs.
Development of metal-oxide based sensors, concerns with the development of advanced thin and thick film deposition techniques for metal-oxides for the fabrication of passive and active gas sensors.
Development of hybrid microcircuits for telecommunications; the project aims at the hybridization of telecommunications electronic subsystems and the development of high power packaging techniques and reliability studies.
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